Global Semiconductor Packaging Material Market – Industry Analysis, Share, Forecast 2020
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- Date Submitted: 09/28/2016 03:22 AM
- Pages: 3
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Semiconductor packaging material consists of material used for protecting electronic components such as ICs and semiconductors from external impact, corrosion and other similar factors. These materials are used in conjunction with various other advanced packaging technologies for packaging of integrated circuits and semiconductors.
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Semiconductor packaging material can be classified in eight sub-types which include bonding wires, organic substrates, encapsulation resins, leadframes, die attach materials, ceramic packages, solder balls and thermal interface materials amongst others. The organic substrates accounts for the largest market share in semiconductor packaging material. Organic substrates are extensively used as base materials for semiconductor packaging. Bonding wires have been used widely as packaging material for semiconductors, but recently there has been a shift towards copper bonding wires for semiconductor packaging. The market for encapsulation resins is expected to witness strong growth in the next few years since encapsulation resins are relatively novel packaging materials. The semiconductor packaging materials are application specific and available across the globe. The various packaging technologies include GA, SOP, QFN, DFN, QFA and similar others which generally depends on the end-use.
The market for semiconductor packaging material is expected to witness strong growth in the next few years on account of explosive growth in communication and mobile computing devices such as tablets and smartphones across the globe. Growth in mobile devices is also anticipated to drive the demand for wafer level packages. With the continued growth in the mobile devices market the market for semiconductor packaging materials is expected to witness strong growth in the next few years. The increase in demand for semiconductor packaging material...
Get the Full Report at:
http://www.transparencymarketresearch.com/semiconductor-packaging-material-market.html
Semiconductor packaging material can be classified in eight sub-types which include bonding wires, organic substrates, encapsulation resins, leadframes, die attach materials, ceramic packages, solder balls and thermal interface materials amongst others. The organic substrates accounts for the largest market share in semiconductor packaging material. Organic substrates are extensively used as base materials for semiconductor packaging. Bonding wires have been used widely as packaging material for semiconductors, but recently there has been a shift towards copper bonding wires for semiconductor packaging. The market for encapsulation resins is expected to witness strong growth in the next few years since encapsulation resins are relatively novel packaging materials. The semiconductor packaging materials are application specific and available across the globe. The various packaging technologies include GA, SOP, QFN, DFN, QFA and similar others which generally depends on the end-use.
The market for semiconductor packaging material is expected to witness strong growth in the next few years on account of explosive growth in communication and mobile computing devices such as tablets and smartphones across the globe. Growth in mobile devices is also anticipated to drive the demand for wafer level packages. With the continued growth in the mobile devices market the market for semiconductor packaging materials is expected to witness strong growth in the next few years. The increase in demand for semiconductor packaging material...